Faculty Profile

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  • +880-2-966-1255, +880-2-966-1301, +880-2-966-5686
  • [email protected]
  • University of Liberal Arts Bangladesh House 56, Road 4/A, Dhanmondi, Dhaka-1209
  • PhD in Electronic Engineering, City University of Hong Kong.

Areas of Interest
Research area includes Electronic Product Reliability and Electronic Packaging, Lead-free Nano Composite Solders and Final Surface Finish.

Tama Fouzder, PhD

Assistant Professor

Overview

Tama Fouzder has nine months working experience as a research assistant at EPA Centre, Electronic Engineering Department, City University of Hong Kong. She has three years teaching experience as a lecturer in Electronic and Telecommunication Engineering Department, University of Development Alternative, Dhaka, Bangladesh. At present, she is teaching as an assistant professor and department coordinator in Electrical and Electronic Engineering Department, University of Liberal Arts, Dhaka, Bangladesh.

Research & Awards

Awards:

  • Hong Kong Government Postgraduate Studentship, UGC-Funded, (2012-2015)
  • EPMSE Scholarship, Student Development Service of City University of Hong Kong.

Publications

Journal Articles

Tama Fouzder, Ismathullakhan Shafiq, Y.C. Chan, A. Sharif, Winco K.C. Yung “Influence of SrTiO3nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds 509, (2011), pp.1885-1892.

Tama Fouzder, Asit Kumar Gain, Y. C. Chan, A. Sharif and Winco K. C. Yung “Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads” Microelectronics Reliability 50, (2010), pp. 2051–2058

Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan, “Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates” Materials in Electronics, 25, (2014), pp.2529-253

Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan “Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates” Journal of Materials Science: Materials in Electronics, 25, (2014), pp.4012-402

Tama Fouzder, Y.C. Chan, Daniel K. Chan “Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin-silver-copper (Sn-Ag-Cu) solders on silver (Ag) surface-finished copper (Cu) substrates” Accepted in Journal of Materials Science: Materials in Electronics, 25 (2014)

Tama Fouzder, Asit Kumar Gain, Daniel K. Chan, “Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates” Journal of Materials Science: Materials in Electronics. 28 (2017), pp. 16921-16931

Asit Kumar Gain, Tama Fouzder, Y. C. Chan, A. Sharif, N. B. Wong and Winco K. C. Yung “The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds 506 (2010) 216–223.

Mansur Ahmed, Tama Fouzder, A. Sharif, Asit Kumar Gain, Y. C. Chan, “Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-Zn binary eutectic solder alloy” Microelectronics Reliability 50 (2010) 1134–1141.

Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif and Winco K. C. Yung “Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads Original” Journal of Alloys and Compounds 509 (2011) 3319–3325.

Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung, “Investigation of Small Sn-3.5Ag-0.5Cu Additions on the Microstructure and Properties of Sn–8Zn-3Bi Solder on Au/Ni/Cu pads” Journal of Alloys and Compounds,Vol. 489, (2010) pp.678–684.

The University of Liberal Arts Bangladesh and its curricula are accredited by the University Grants Commission (UGC) of Bangladesh, and approved by the Ministry of Education, Government of People's Republic of Bangladesh.