Areas of Interest
Electronic Product Reliability and Electronic Packaging, Lead-free Nano Composite Solders, Antenna Engineering and Renewable energy.
Tama Fouzder has nine months working experience as a research assistant at EPA Centre, Electronic Engineering Department, City University of Hong Kong. She has three years teaching experience as a lecturer in Electronic and Telecommunication Engineering Department, University of Development Alternative, Dhaka, Bangladesh. At present, she is teaching as an assistant professor and department coordinator in Electrical and Electronic Engineering Department, University of Liberal Arts, Dhaka, Bangladesh.
Awards:
Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan, “Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates” Materials in Electronics, 25, (2014), pp.2529-253
Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan “Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates” Journal of Materials Science: Materials in Electronics, 25, (2014), pp.4012-402
Tama Fouzder, Y.C. Chan, Daniel K. Chan “Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin-silver-copper (Sn-Ag-Cu) solders on silver (Ag) surface-finished copper (Cu) substrates” Accepted in Journal of Materials Science: Materials in Electronics, 25 (2014)
Tama Fouzder, Asit Kumar Gain, Daniel K. Chan, “Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates” Journal of Materials Science: Materials in Electronics. 28 (2017), pp. 16921-16931
Mansur Ahmed, Tama Fouzder, A. Sharif, Asit Kumar Gain, Y. C. Chan, “Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-Zn binary eutectic solder alloy” Microelectronics Reliability 50 (2010) 1134–1141.
Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif and Winco K. C. Yung “Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads Original” Journal of Alloys and Compounds 509 (2011) 3319–3325.
Tama Fouzder, Asit Kumar Gain, Daniel K. Chan, “Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates” Journal of Materials Science: Materials in Electronics 28 (2017), pp. 16921-16931.(IF=2.195)
Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan, “Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates” Journal of Materials Science: Materials in Electronics, 25, (2014), pp. 2529-2539. (IF=2.195).
Tama Fouzder, IsmathullakhanShafiq, Y.C. Chan, A. Sharif, Winco K.C. Yung “Influence of SrTiO3nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds 509, (2011), pp.1885-1892. (IF=4.175).
Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung “Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads Original” Journal of Alloys and Compounds 509 (2011), pp. 3319–3325. (IF=4.175).
Tama Fouzder, Asit Kumar Gain, Y. C. Chan, A. Sharif , Winco K. C. Yung “Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads” Microelectronics Reliability 50, (2010), pp. 2051–2058. (IF=1.483).
Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung, “Investigation of Small Sn-3.5Ag-0.5Cu Additions on the Microstructure and Properties of Sn–8Zn-3Bi Solder on Au/Ni/Cu pads” Journal of Alloys and Compounds,Vol. 489, (2010), pp.678–684. (IF=4.175).
Asit Kumar Gain, Tama Fouzder, Y. C. Chan, A. Sharif, N. B. Wong, Winco K. C. Yung “The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds 506 (2010), pp. 216–223. (IF=4.175).
Mansur Ahmed, Tama Fouzder, A. Sharif, Asit Kumar Gain, Y. C. Chan, “Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-Zn binary eutectic solder alloy” Microelectronics Reliability 50 (2010), pp. 1134–1141. (IF=1.483)
Muhammad Shafeeq, Muhammad Ibrahim, ZahidUllah, Abdul Hafeez, Tama Fouzder, “A Wearable Millimeter Wave MIMO Antenna Design for High Frequency Applications” Accepted in International Conference on Advances in the Emerging Computing Technologies (AECT), Saudi Arabia, February 10-12, 2020.
Najib Ur Rehman, Omer Mujahid, ZahidUllah, Abdul Hafeez, Tama Fouzder, Muhammad Ibrahim, “ Power Efficient FPGA-based TCAM Architecture by Using Segmented Matchline Strategy” Accepted in International Conference on Advances in the Emerging Computing Technologies (AECT), Saudi Arabia, February 10-12,
Mohammad Muntasir Hassan, Mehede Hassan Murad, Tama Fouzder, Sameia Zaman and MdZunaidBaten, “Absorption Enhancement of GaAs Thin-Film with Geometrically Varying Periodic Array of SiO2 Nanostructures” 3rd IEEE International Conference on Telecommunications and Photonics (ICTP), Bangladesh, December
Omer Mujahid, ZahidUllah, Abdul Hafeez, Tama Fouzder, “Design Exploration of LH-CAM with Updating Mechanism” 3rd International Joint Conference on Computational Intelligence (IJCCI), Bangladesh, October 25-26, 2019.
Methila Biswas Raya, Tama Fouzder, M. Mofazzal Hossain, Khaleda Ali, “Polypropylene Sheet Reinforced Textile Antenna with Reduced Bending Effects” 5thInternational Conference on Advances in Electrical Engineering (ICAEE), Bangladesh, September 26-28, 20
ZahidUllah, NasruMinallah, Safdar Nawaz Khan Marwat, Abdul Hafeez, Tama Fouzder, “Analysis of Cache Size and Set-Associativity using simple Scalar Benchmark” 5thInternational Conference on Advances in Electrical Engineering (ICAEE), Bangladesh, September 26-28, 2019.
Tama Fouzder, Y.C. Chan, Daniel K. Chan, “Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates” 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, December, 2014, p.69-74.
Tama Fouzder, Y.C. Chan, Daniel K. Chan, “Microstructure and Plating Thickness Analysis of Different Surface Finished Plated Printed Circuit Boards” 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, December, 2012, p.4-6.
Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung “Influence of additions of ceramic (ZrO2, Al2O3) nano particles on the microstructure and shear strength of Sn-Ag-Cu solder” International Conference on Electronics Packaging (ICEP), Japan, May 12~14, 2010 p.470-47
Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, N. B. Wong , Winco K. C. Yung “Effect of additions of metallic (Ag, Ni) nano particles on the microstructure and shear strength of Sn-Zn solder in ball grid array packages” International Conference on Electronics Packaging (ICEP), Japan, May 12~14, 2010 p.337-340.
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