Areas of Interest
Research area includes Electronic Product Reliability and Electronic Packaging, Lead-free Nano Composite Solders and Final Surface Finish.
Tama Fouzder has nine months working experience as a research assistant at EPA Centre, Electronic Engineering Department, City University of Hong Kong. She has three years teaching experience as a lecturer in Electronic and Telecommunication Engineering Department, University of Development Alternative, Dhaka, Bangladesh. At present, she is teaching as an assistant professor and department coordinator in Electrical and Electronic Engineering Department, University of Liberal Arts, Dhaka, Bangladesh.
Awards:
Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan, “Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates” Materials in Electronics, 25, (2014), pp.2529-253
Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan “Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates” Journal of Materials Science: Materials in Electronics, 25, (2014), pp.4012-402
Tama Fouzder, Y.C. Chan, Daniel K. Chan “Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin-silver-copper (Sn-Ag-Cu) solders on silver (Ag) surface-finished copper (Cu) substrates” Accepted in Journal of Materials Science: Materials in Electronics, 25 (2014)
Tama Fouzder, Asit Kumar Gain, Daniel K. Chan, “Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates” Journal of Materials Science: Materials in Electronics. 28 (2017), pp. 16921-16931
Mansur Ahmed, Tama Fouzder, A. Sharif, Asit Kumar Gain, Y. C. Chan, “Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-Zn binary eutectic solder alloy” Microelectronics Reliability 50 (2010) 1134–1141.
Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif and Winco K. C. Yung “Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads Original” Journal of Alloys and Compounds 509 (2011) 3319–3325.
